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data sheet caution observe precautions when handling because these devices are sensitive to electrostatic discharge. the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec compound semiconductor devices representative for availability and additional information. tx and rx mcp ic for 1.9 ghz phs bipolar analog integrated circuit pc8220t5a document no. pu10532ej01v0ds (1st edition) date published november 2004 cp(k) printed in japan ? nec compound semiconductor devices, ltd. 2004 description the pc8220t5a is mcp (multi chip packaging) ic consist ed of silicon germanium (s ige) bipolar process and ldmos designed for use as transmitting and receiving for 1.9 ghz phs. this device is packaged in surface mount 16-pin plas tic tson (thin small outline non-leaded) package. this ic manufactured using our 50 ghz f max uhs2 (u ltra h igh s peed process) sige bipolar process and ldmos (l ateral d iffusion mos fet process). features ? tx block ? ? circuit current (drv + pa) : i = 160 ma typ. @ v cc = v ds = 3.0 v, f = 1.9 ghz, p in = ? 19 dbm, p out = +20.5 dbm output power : p out = +20.5 dbm min. @ v cc = v ds = 3.0 v, f = 1.9 ghz, p in = ? 19 dbm power gain : g p = 39.5 db min. @ v cc = v ds = 3.0 v, f = 1.9 ghz, p in = ? 19 dbm adjacent channel power : p adj1 = ? 65 dbc typ. @ v cc = v ds = 3.0 v, f = 1.9 ghz, p out = +20.5 dbm, ? 600 khz : p adj2 = ? 70 dbc typ. @ v cc = v ds = 3.0 v, f = 1.9 ghz, p out = +20.5 dbm, ? 900 khz harmonics frequency level : 2f 0 = ? 45 dbc typ. @ v cc = v ds = 3.0 v, p out = +20.5 dbm : 3f 0 = ? 60 dbc typ. @ v cc = v ds = 3.0 v, p out = +20.5 dbm gain 1 db compression output power : p o (1 db) = +21 dbm typ. @ v cc = v ds = 3.0 v ? rx block ? circuit current : i cc = 11.5 ma typ. @ v cc = 3.0 v convertion gain : cg = 21.5 db typ. @ f rf = 1.9 ghz, f if = 240 mhz, f lo = 1.66 ghz noise figure : nf = 3.1 db typ. @ ssb input 3rd order distortion : iip 3 = ? 14.5 dbm typ. @ f rf1 = 1.9 ghz, f rf2 = 1.9006 ghz, p rf = ? 35 dbm/tome intercept point image rejection ratio : imr = 40 dbc typ. @ f rf1 = 1.9 ghz, f rf2 = 1.42 ghz, p rf = ? 35 dbm/tome high-density surface mounting : 16-pin plastic tson package (3.3 2.3 0.6 mm) application phs ordering information part number order number package marking supplying form pc8220t5a-e1 pc8220t5a-e1-a 16-pin plastic tson (pb-free) note 8220 embossed tape 12 mm wide pin 8, 9 face the perforation side of the tape qty 3 kpcs/reel note with regards to terminal solder (the solder contai ns lead) plated products (conv entionally plated), contact your nearby sales office. remark to order evaluation samples, contact your nearby sales office. part number for sample order: pc8220t5a
data sheet pu10532ej01v0ds 2 pc8220t5a pin connections and internal block diagram pin no. pin name pin no. pin name 1 rf in 9 input2 2 lna out 10 output1 3 gnd (lna) 11 v cc (tx) 4 lna in 12 gnd (drv) 5 gnd (drv) 13 input1 6 gnd (drv) 14 if out 7 out2 (pa) 15 v cc (rx) (top view) 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 rx block tx block 8 out2 (pa) 16 lo in note on correct use exposed heatsink at bottom on package that is combined with gnd (ground) must be soldered to pcb rf/dc ground. absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit lna output voltage v lnaout 4.0 v mixier output voltage v cc , if out 4.0 v driver output voltage v cc , v out1 4.0 v pa drain-source voltage v ds 8.0 v pa gate-source voltage v gs 8.0 v input power 1 p in1 +10 dbm input power 2 p in2 +16 dbm lna input power p lnain +10 dbm local input power p loin +10 dbm channel temperature t ch 150 c operating ambient temperature t a ? 30 to +70 c storage temperature t stg ? 55 to +150 c power dissipation of package p d 5.33 note w circuit current 1 (lna + mixer) i cc1 21 ma circuit current 2 (pa driver) i cc2 70 ma circuit current 3 (pa) i ds 259 ma note mounted on 33 21 0.4 mm polyimide pcb
data sheet pu10532ej01v0ds 3 pc8220t5a recommended operating range (t a = +25 c, unless otherwise specified) parameter symbol min. typ. max. unit lna output voltage v lnaout 2.7 3.0 3.3 v mixer output voltage v cc , if out 2.7 3.0 3.3 v driver output voltage v cc , v out1 2.7 3.0 3.3 v pa drain-source voltage v ds 2.7 3.0 3.5 v pa gate-source voltage v gs 0 2.0 2.5 v operating ambient temperature t a ? 30 +25 +70 c rf input frequency f rf 1.8 1.9 2.0 ghz local input power p loin ? 20 ? 15 ? 10 dbm
data sheet pu10532ej01v0ds 4 pc8220t5a electrical characteristics ? tx block ? (t a = +25 c, v cc = v ds = 3.0 v, z s = z l = 50 ? , unless otherwise specified) parameter symbol test conditions min. typ. max. unit threshold voltage v th i ds = 8 ma, v ds = 3.5 v 1.15 1.4 1.65 v gate-source voltage v gs 1.5 1.8 2.1 v circuit current (drv + pa) i f = 1.9 ghz, p in = ? 19 dbm, p out = +20.5 dbm ? 160 190 ma input return loss rl in ? 10 ? db output return loss rl out f = 1.9 ghz, p in = ? 19 dbm ? 5 ? db output power p out +20.5 ? ? dbm power gain (drv + pa) g p 39.5 40.5 ? db power gain (drv) g p (drv) ? 31 ? db power gain (pa) g p (pa) f = 1.9 ghz, p in = ? 19 dbm, v gs adjusting ? 9.5 ? db liner gain g l p in = ? 20 dbm ? 40.5 ? db adjacent channel power 1 p adj1 f = 1.9 ghz, p out = +20.5 dbm ? 600 khz note ? ? 65 ? 58 dbc adjacent channel power 2 p adj2 f = 1.9 ghz, p out = +20.5 dbm ? 900 khz note ? ? 70 ? 60 dbc occupied band width obw p out = +20.5 dbm note ? 250 270 khz 2nd harmonics frequency level 2f 0 p out = +20.5 dbm ? 40 ? 45 ? dbc 3rd harmonics frequency level 3f 0 p out = +20.5 dbm ? 55 ? 60 ? dbc gain 1 db compression output power p o (1 db) ? +21.0 ? dbm note p in = ? 19 dbm, cw: measure by changing to modulation wave, after setting from adjusting by v gs to p out = +20.5 dbm. ? rx block ? (t a = +25 c, v cc = 3.0 v, f rf = 1.9 ghz, f if = 240 mhz, f lo = 1.66 ghz, p loin = ? 15 dbm, z s = z l = 50 ?, unless otherwise specified) parameter symbol test conditions min. typ. max. unit circuit current i cc no signal 8.9 11.5 15.0 ma circuit current (lna) i cclna no signal 1.25 1.8 ? ma convertion gain (lna + mixer) cg p rf = ? 35 dbm 19.0 21.5 25.5 db convertion gain (lna) cg (lna) p rf = ? 35 dbm ? 15.5 ? db convertion gain (mixer) cg (mixer) p rf = ? 20 dbm ? 6.0 ? db noise figure nf ssb ? 3.1 4.5 db input 3rd order distortion intercept point iip 3 f rf1 = 1.9 ghz, f rf2 = 1.9006 ghz, p rf = ? 35 dbm/tone ? 16.5 ? 14.5 ? dbm image rejection ratio imr f rf1 = 1.9 ghz, f rf2 = 1.42 ghz, p rf = ? 35 dbm/tone 30 40 ? dbc 1/2 if ratio 1/2 ifr f rf1 = 1.9 ghz, f rf2 = 1.78 ghz, p rf = ? 35 dbm/tone, f if = 240 mhz 40 50 ? dbc local leak lo leak lo in lna in leak ? ? 62 ? 50 dbm
data sheet pu10532ej01v0ds 5 pc8220t5a evaluation circuit (v cc = v ds = 3.0 v) v cc rx if out 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 rx tx lo in tx in v cc tx v gs 10 ? 10 nh 120 pf 2 pf 1 000 pf 3 pf 1 000 pf 100 nh 82 nh 3.3 nh 1 f 3.9 nh 1 000 pf 1.0 nh 3 pf 3.3 nh 2 pf 1 f rf in 4.7 nh 1.0 pf 0.5 pf 0.5 pf 3.9 nh 100 pf 56 pf 3.9 nh 1.5 pf 1.5 pf 1.5 pf 2.2 nh 39 nh wire wound chip inductor 100 ? 1 f v cc tx out v ds the application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
data sheet pu10532ej01v0ds 6 pc8220t5a typical characteristics (t a = +25 c, unless otherwise specified) ? tx block ? (v cc = v ds = 3.0 v, f = 1.9 ghz, p in = ? 19 dbm, p out = +20.5 dbm) p out output power p out (dbm) input power p in (dbm) adjacent channel power p adj (dbc) 25 20 15 10 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?20 ?25 ?30 ?15 ?10 ?600 ?900 +600 +900 p adj output power, adjacent channel power vs. input power circuit current (drv + pa) i (ma) input power p in (dbm) 200 180 160 140 120 100 80 60 40 20 0 ?20 ?25 ?30 ?15 ?10 drv pa drv + pa circuit current (drv + pa) vs. input power remark the graphs indicate nominal characteristics.
data sheet pu10532ej01v0ds 7 pc8220t5a ? rx block ? (v cc = 3.0 v, f rf1 = 1.90 ghz, p rf1 = ? 35 dbm, f rf2 = 1.9006 ghz , p rf2 = ? 35 dbm, f lo = 1.66 ghz) ?13 ?14 ?15 ?16 ?9 ?11 ?13 ?15 ?17 ?19 local input power p loin (dbm) input 3rd order distortion intercept point iip 3 (dbm) convertion gain cg (db) local input power p loin (dbm) 24 23 22 21 ?9 ?11 ?13 ?15 ?17 ?19 noise figure nf (db) local input power p loin (dbm) 4.5 4 3.5 3 ?9 ?11 ?13 ?15 ?17 ?19 convertion gain vs. local input power noise figure vs. local input power iip 3 vs. local input power remark the graphs indicate nominal characteristics.
data sheet pu10532ej01v0ds 8 pc8220t5a package dimensions 16-pin plastic tson (unit: mm) 3.30.1 2.30.1 2.50.15 0.40.05 0.160.05 3.50.15 0.6 max. (bottom view) (1.1) (1.6) (0.45) (2.2) (0.55) remark ( ) : reference value
data sheet pu10532ej01v0ds 9 pc8220t5a recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recomm ended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ir260 wave soldering peak temperature (molten solder temperature) : 260 c or below time at peak temperature : 10 seconds or less preheating temperature (package surface temperature) : 120 c or below maximum number of flow processes : 1 time maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below ws260 partial heating peak temperatur e (terminal temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin fl ux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering met hods together (except for partial heating).
data sheet pu10532ej01v0ds 10 pc8220t5a m8e 00. 4 - 0110 the information in this document is current as of november, 2004. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product be fore using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation, nec compound semiconductor devices, ltd. and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?
nec compound semiconductor devices hong kong limited e-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general) hong kong head office taipei branch office korea branch office tel: +852-3107-7303 tel: +886-2-8712-0478 tel: +82-2-558-2120 fax: +852-3107-7309 fax: +886-2-2545-3859 fax: +82-2-558-5209 nec electronics (europe) gmbh http://www.ee.nec.de/ tel: +49-211-6503-0 fax: +49-211-6503-1327 california eastern laboratories, inc. http://www.cel.com/ tel: +1-408-988-3500 fax: +1-408-988-0279 0406 nec compound semiconductor devices, ltd. http://www.ncsd.necel.com/ e-mail: salesinfo@ml.ncsd.necel.com (sales and general) techinfo@ml.ncsd.necel.com (technical) sales division tel: +81-44-435-1588 fax: +81-44-435-1579 for further information, please contact pc8220t5a

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